Solutions Engineer

Synopsys
Mountain View, CA
14 days ago
Synopsys
Synopsys
synopsys.com

Job Description

49879BR
USA - California - Mountain View/Sunnyvale

Job Description and Requirements

At Synopsys, we’re at the heart of the innovations that change the way we work and play. Self-driving cars. Artificial Intelligence. The cloud. 5G. The Internet of Things. These breakthroughs are ushering in the Era of Smart Everything. And we’re powering it all with the world’s most advanced technologies for chip design and software security. If you share our passion for innovation, we want to meet you.

We are looking for a Solutions Engineer to join our Advanced Package Solutions team. This team is at the forefront of market-changing innovations towards enablement of Multi-Die Systems across broad customer markets.

In this role, you will learn and apply knowledge in areas of Advanced Package Design, 3DIC Multi-die Systems, and Signoff for manufacturing.
  • You will work to define and develop advanced Synopsys EDA products and solutions. This will involve working closely with internal engineers to develop methodologies to solve customer problems and to improve Synopsys tools and flows.
  • You will work closely with our customers defining necessary Synopsys products to design and optimize complex package solutions. This position will also collaborate with Foundries and Assembly & Test companies to ensure Synopsys products are providing industry leading capabilities aligned to Advanced Packaging.
  • Work with customers, R&D, and partner companies to specify, develop and test EDA design flows.
  • Assist in the gathering, refining, writing and tracking of requirements as use models, design flows, and new tool capabilities.

Key Qualifications:
  • Bachelor’s and/or master’s degree in electrical and/or Electronic Engineering, Computer Engineering or Computer Science
  • Minimum 4+ years experience with Advanced Package Design methodologies and flows
  • Proficiency in planning and physical design methodology, along with prep for manufacturing
  • Knowledge of current Package Design EDA solutions
  • Proficiency in Linux, Tcl, Perl, of other scripting is highly desired.
  • Experience with 3DIC or multi-die package implementation is a plus.
  • Excellent skills in multi-tasking, collaboration and communication in a global multi-cultural environment are required.
  • Good communication skills while interacting with internal teams and customers
  • High degree of self-motivation and personal responsibility
#LI-DP1

At Synopsys, we’re at the heart of the innovations that change the way we work and play. Self-driving cars. Artificial Intelligence. The cloud. 5G. The Internet of Things. These breakthroughs are ushering in the Era of Smart Everything. And we’re powering it all with the world’s most advanced technologies for chip design and software security. If you share our passion for innovation, we want to meet you.

Stay Connected: Join our Talent Community

The base salary range across the U.S. for this role is between $130,000-$196,000. In addition, this role may be eligible for an annual bonus, equity, and other discretionary bonuses. Synopsys offers comprehensive health, wellness, and financial benefits as part of a competitive total rewards package. The actual compensation offered will be based on a number of job-related factors, including location, skills, experience, and education. Your recruiter can share more specific details on the total rewards package upon request.

Inclusion and Diversity are important to us. Synopsys considers all applicants for employment without regard to race, color, religion, national origin, gender, sexual orientation, gender identity, age, military veteran status, or disability.

Job Category

Engineering

Country

United States

Job Subcategory

R&D Engineering

Hire Type

Employee

Base Salary Range

130000-196000

Visit Original Source:

https://www.indeed.com/viewjob
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